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Abrasives are the main raw material for the manufacture of grinding wheels and are directly responsible for cutting work.

Diamond: It is suitable for processing high-hard metal and non-metal hard and brittle materials that are difficult to process with ordinary material grinding wheels. Such as cemented carbide, optical glass, ceramics, stone, semiconductor materials. Particle size Particle size refers to the size of the abrasive particles, the size of which is indicated by the particle size number. The national standard specifies two sizes of abrasive and micro-powder. Generally speaking, rough grinding uses coarser abrasives (smaller size), fine grinding uses finer abrasives (larger size); fine powders are used for precision machining and ultra-precision machining.

The ceramic diamond grinding wheel generally has a particle size range of w1.5~80/100. The binder acts to bond the abrasive into a grinding wheel of a certain strength and shape. The strength, impact resistance, heat resistance and corrosion resistance of the grinding wheel mainly depend on the properties of the bonding agent.

Commonly used binders include ceramic binder (V), resin binder (B), rubber binder (R), and metal binder (M).

Ceramic bond: the most widely used, suitable for external, inner, flat, centerless grinding and forming grinding wheels;

Resin bond: suitable for cutting and grooving sheet grinding wheels and high-speed grinding wheels;

Rubber bonding agent: suitable for centerless grinding guide wheel and polishing wheel;

Metal bond: suitable for diamond grinding wheels, etc.

Research direction Ceramic bond diamond research mainly from several aspects [1] research on low temperature, high strength, low expansion coefficient ceramic bond; [2] performance improvement of ceramic bond; [3] ceramic bond and diamond abrasive Wetting research between the two; [4] Research on surface modification of diamond abrasive grains; [5] Research on improvement of grinding wheel structure; [6] Research on optimum preparation parameters of grinding wheel; [7] Optimal grinding process parameters and grinding method Research and so on.